News
Financial Information
Winbond Injected USD 12.45 Million into Winbond Int’l Corporation
Jul/30/2010
Taichung, Taiwan, July 30, 2010- Winbond Electronics Corporation (TSE: 2344), a worldwide leading supplier of specialty memory, today announced that it has made a capital injection of USD 12.45 million into Winbond Int’l Corporation (WIC). The purpose of the capital injection is to finance the general working capital of Winbond Electronics Corporation America (WECA).
Located in San Jose, California, WECA is dedicated to IC design, marketing and product sales in Europe and the U.S. The main products include NOR Flash ICs and SDRAM ICs. WIC wholly owns the stocks of WECA and entrusts WECA with the product research and development.
Spokesperson
James Wen
Vice President of Finance Center & CFO
Tel：02-81777168
News Liaison
Ivy Hsu
Professional Assistant Manager
Tel：0966-233361
Email：hchsu10@winbond.com
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